Pressure sintering furnace for the production of composite substrates

Contact person

Prof. Jens Müller
Electronics Technology Group

Phone: +49 3677 69-2606
e-mail: jens.mueller@tu-ilmenau.de

Funding information

Funding source: Europäische Fonds für regionale Entwicklung - Kofinanziert von der EU

Project leader: Thüringer Aufbaubank

Project number:  2019 FGI 0014

Participatinggroups: Electronics Technology Group, Microsystems Technology Group, Optical Engineering Group, Group for Inorganic Non-metallic Materials, RF and Microwave Research Group

Period of funding:  01.01.2020 - 30.09.2021

Project information

Michael Fischer
Media plan for sensors, gas and vacuum

The sintering of low-temperature ceramics (LTCC) under a pressure of approx. 0.5 MPa is an established technology to prevent lateral shrinkage during the densification process with the aim of minimizing shrinkage deviations in this context. The latter are responsible for the coverage accuracy in mask-based post processes. Furthermore, the planarity of the substrates is improved compared to free sintering. Industrially, this process is used for the volume production of planar circuit carriers and electrical components for automotive applications and for communication technology. Disadvantage of the process is the limitation to planar substrates without cavities or cavities, which are needed e.g. in fluid sensor technology.