Prof. Jens Müller
Electronics Technology Group
Phone: +49 3677 69-2606
Project leader: Thüringer Aufbaubank
Project number: 2019 FGI 0014
Participatinggroups: Electronics Technology Group, Microsystems Technology Group, Optical Engineering Group, Group for Inorganic Non-metallic Materials, RF and Microwave Research Group
Period of funding: 01.01.2020 - 30.09.2021
The sintering of low-temperature ceramics (LTCC) under a pressure of approx. 0.5 MPa is an established technology to prevent lateral shrinkage during the densification process with the aim of minimizing shrinkage deviations in this context. The latter are responsible for the coverage accuracy in mask-based post processes. Furthermore, the planarity of the substrates is improved compared to free sintering. Industrially, this process is used for the volume production of planar circuit carriers and electrical components for automotive applications and for communication technology. Disadvantage of the process is the limitation to planar substrates without cavities or cavities, which are needed e.g. in fluid sensor technology.