Drucksinterofen

The sintering of low-temperature ceramics (LTCC) under a pressure of approx. 0.5 MPa is an established technology to prevent lateral shrinkage during the densification process with the aim of minimizing shrinkage deviations in this context. The latter are responsible for the coverage accuracy in mask-based post processes. Furthermore, the planarity of the substrates is improved compared to free sintering. Industrially, this process is used for the volume production of planar circuit carriers and electrical components for automotive applications and for communication technology. Disadvantage of the process is the limitation to planar substrates without cavities or cavities, which are needed e.g. in fluid sensor technology.