The project 3DWeMo (2D and 3D material morphologies for reactive microjoining in electronics) investigates the influence of substrate morphology on a reactive multilayer layer. Even progressive reactions of metallic multilayers, especially those based on Ni/Al, have been extensively investigated over the last decades. The focus has been on nanofilms and sputtered layer systems. The exploitation of these reactions for the joining of electronic chips or micromechanical components (MEMS) offers the advantage of a locally limited heat load. The chain reaction triggered by local ignition is difficult to control and the reaction products often exhibit high stresses. It is known that nanoscale radii of curvature influence the surface and interfacial energy. This is to be exploited to specifically influence the free enthalpy of a multilayer sequence and thus influence acceleration and speed of the reaction propagation. An additional factor is the changed multilayer morphology due to the nanostructure, which also influences the progress of the reaction. In the project different multilayer architectures are investigated, taking into account both the surface shape and the layer structure. Their influence on the phase transformation is investigated.
Thus, the basis for the development of prefabricated structures for a future chip assembly is laid. The acquired knowledge contributes to tailor-made packaging and interconnection technology, which in future will exploit defined ignition paths for the dosed energy input in solder connections for chip assembly.
Project Manager: Dr.-Ing. Heike Bartsch
Project duration: 15.11.2019 - 31.12.2025
Funding: DFG
Partner: Department of Materials in Electrical Engineering
