i-FPS Compact, high-performance and higly integrated faint pulse source at 850 nm; subproject: E/O hardware platform for faint pulse source

The aim of the overall project is to realise a compact photon source with attenuated pulses, a so-called faint pulse source, for the generation of quantum keys with a high key rate in satellite-based communication. The overall objectives of the sub-project are subordinate to this overarching goal and focus on the electronics development and RF-compatible module integration of a faint pulse source that meets the requirements for use in satellite communication. The central issues are mechanical and thermomechanical robustness as well as miniaturisation and weight minimisation. To solve the complex task for the hardware platform, a multilayer ceramic technology developed and verified within the framework of DLR-funded projects is to be used.

Project manager: Prof. Dr.-Ing. Jens Müller
Scientific assistent:  M. Sc. Cathleen Kleinholz
Project duration: 01.08.2021 - 30.06.2024
Project leader: Deutsches Zentrum für Luft- und Raumfahrt e. V. (DLR)
Participating groups:: Hochfrequenz- und Mikrowellentechnik

3DWeMo

The project 3DWeMo (2D and 3D material morphologies for reactive microjoining in electronics) investigates the influence of substrate morphology on a reactive multilayer layer. Even progressive reactions of metallic multilayers, especially those based on Ni/Al, have been extensively investigated over the last decades. The focus has been on nanofilms and sputtered layer systems. The exploitation of these reactions for the joining of electronic chips or micromechanical components (MEMS) offers the advantage of a locally limited heat load. The chain reaction triggered by local ignition is difficult to control and the reaction products often exhibit high stresses. It is known that nanoscale radii of curvature influence the surface and interfacial energy. This is to be exploited to specifically influence the free enthalpy of a multilayer sequence and thus influence acceleration and speed of the reaction propagation. An additional factor is the changed multilayer morphology due to the nanostructure, which also influences the progress of the reaction. In the project different multilayer architectures are investigated, taking into account both the surface shape and the layer structure. Their influence on the phase transformation is investigated.

Thus, the basis for the development of prefabricated structures for a future chip assembly is laid. The acquired knowledge contributes to tailor-made packaging and interconnection technology, which in future will exploit defined ignition paths for the dosed energy input in solder connections for chip assembly.

Project Manager: Dr.-Ing. Heike Bartsch

Research assistant: M. Sc. Konrad Jaekel

Project duration: 15.11.2019 - 30.09.2023

Funding: DFG

Partner: Department of Materials in Electrical Engineering

Memristive materials for neuromorphic electronics (MemWerk)

LTCC wafers with vertical contacts (vias) and a surface suitable for lithography

The aim of the MemWerk (Memristive Materials for Neuromorphic Electronics) project is to develop new functional memristic materials for energy-efficient neuromorphic electronics, i.e. electronic systems whose principle is based on paradigms of biological information processing.

Memristive materials have a memory effect and can change their electronic properties (electrical resistance) by external signals (e.g. electrical current or voltage, gases, light, temperature, etc.). Consequently, these materials enable the creation of devices whose functions are in many respects similar to those of synapses in neural networks. They thus form the central plastic building block in artificial neural networks (ANNs).

The development focus of the subproject is on system integration. Connection and contact concepts are developed and tested that electrically address a larger field or cluster of memristive components without recourse to intersection structures.

The following concepts will be considered in the implementation of this task:

a) Construction of flip-chip memristive matrices on a multilayer LTCC substrate.

b) Direct integration of memristors on a suitable pre-assembled substrate with already implemented wiring. This approach uses low-temperature single-fired ceramic substrates (LTCC) with adapted expansion coefficients. The technology enabled the wiring of up to 100 layers. The smoothing of the sintered LTCC surface is a main focus of development. Polishing processes on different surfaces are used for smoothing.

Subproject manager: Jens Müller

Funding: Carl-Zeiss-Stiftung

Term: 04/2020 - 03/2025

Contact: Dr.-Ing. Heike Bartsch, Dr. Kateryna Soloviova

Link: https://memwerk.de/

µRase - MEMS space sensing radar sensor technology

Space sensing sensor technology plays a crucial role in the design and implementation of autonomous systems. Advanced sensor technology enables autonomous systems to detect other objects, assign velocities and distances, and provide reaction recommendations to the systems' control unit in case of danger to themselves or neighboring objects. The combination of THz radar system, innovative assembly, interconnection and MEMS technology, and silicon-ceramic composite technology can overcome previous limitations.
The goal of the project is to combine and establish individual technology modules of the project partners into a superior radar module with high cost efficiency and high imaging resolution. This project will be realized by combining modular subsystems:

  • pivoting MEMS structures for THz antennas on SiCer substrates
  • radar concepts and signal processing
  • design and construction of ultra-high frequency systems
     

Contact person: Prof. Dr.-Ing. Jens Müller

Scientific assistant: M. Sc. Cathleen Kleinholz

Project duration: 01/2023 - 09/2025

Sponsor: BMBF

Project partners: Fraunhofer FHR, Ruhr University Bochum, Technical University Berlin

 

Reactive microjoining and packaging – mechanical, thermal and electrical functionalities (Part II)

Al/Ni reactive nultilayer systems in LTCC substrate with embedded Pt temperature sensor, (a) before the reaction, (b) after the reaction.

Reactive multilayer systems (RMS) are new developed die attaching methods, allowing the creation of fast, hermetic and homogenous joining between the circuit carrier and the components. This project work focuses on the development of adhesion mechanisms for RMS-bonding of thermally low-conductive substrates such as glass-ceramics. A model is to be developed to describe the mutual relationships between boundary conditions (thermal conductivity, roughness, layer thicknesses, etc.) and process parameters (reaction rate and temperature) and their effect on the joint adhesion. On the experimental side, this is accompanied by the development of a novel in-situ test substrate, which should allow direct temperature measurement during the reaction at the joint using thermocouples instead of embedded and isolated thermistors. In addition, the second phase targets structured, localized RMS bonding for functional characterization.

Project leader: Prof. Dr.-Ing. Jens Müller

Contact person: Dr.-Ing. Nesrine Jaziri

Project duration: from 01/2024 - 12/2025

Funding: DFG

Partners: Saarland University, Department of Systems Engineering, Chair of Microintegration and Reliability

Other completed projects

Quanten HUB Thuringia

Silicon-ceramic hybrid substrate as integration platform for photoacoustic and optical applications (PaSiC)

E-PhoQuant research group

Reactive micro-joining and packaging - mechanical, thermal and electrical functionalities

VEDIAS - digital, internationally oriented study programmes with social virtual reality application (VEDIAS-VR) (running time: 01/2021- 12/2022)

Growth core HIPS (High Performance Sensors) (running time: 09/2019 - 12/2022)

SPIRIT - System - in - Package Interposer based on innovative glass - ceramic - composite - technology (running time: 04/2018 - 09/2021)

Research Group FOQUOS - Thuringian Research Group on Quantum Optical Imaging with Entangled Photons (running time: 03/2018 - 02/2021)

INFERSAT - Integration of ferrite materials for components in satellite communications (running time: 01/2018 - 04/2021)

µNOX - Portable measuring device for the mobile measurement of nitrogen oxides (running time: 05/2017 - 09/2019)

MUSIC - Multiphysical synthesis and integration of complex high-frequency circuits (running time 01/2016 - 06/2019)

BiSWind - Component-integrated sensor technology for power transmission elements in wind turbines (running time 12/2015 - 07/2019)

KERBESEN - Ceramic multilayer components for high-temperature sensors and electronics (running time 01/2016 - 12/2018)

SACCA - System for automatic cell cultivation and analysis (Runtime 01/2014 - 12/2017)

MetaZIK - BioLithoMorphie (BioLithoMorphie I duration: 04/2014 - 03/2015; BioLithoMorphie II duration: 10/2015 - 03/2018)