Silicon-ceramic hybrid substrate as integration platform for photoacoustic and optical applications (PaSiC)

The aim of the project is the further development of the silicon-ceramic sintered composite technology into an industrially widely applicable technology platform for the realization of robust and miniaturized IR components (IR radiation sources and detectors) as well as novel cost-efficient sensors based on photoacoustic and optical principles. For this purpose, the Technology Readiness Level (TRL) of the composite technology achieved from upstream projects is to be raised from 4 to 5-6 in stages.

The research project addresses the combination of the inorganic non-metallic LTCC ceramic with the semi-metallic silicon for a gas-tight composite without permanent organic additives. The joint sintering of silicon and glass ceramic is a central unique selling point. Both materials can be bonded together by sintering on a laboratory scale largely free of pressure and stress. No polishing of the two material partners is necessary for this, but the pre-processed green tape stack of the ceramic is laminated onto a pre-processed silicon wafer and then sintered. The resulting SiCer-hybrid substrate can be further processed - with adapted thin-film processes. The silicon is thus available for MEMS processes, while the LTCC ceramic can be used as a carrier for other functions (e.g. fluidics), as a rewiring level and as a package. Thus, the hybrid substrate offers ideal conditions for the realization of optical sensor elements directly in the silicon wafer. On the other hand, the use of LTCC ceramics as wiring level also allows the classical hybrid integration of further sensor and electronic components.

Contact: Prof. Dr.-Ing. Jens Müller, Dipl.-Ing. Nam Gutzeit

Project duration: 07/2020 - 12/2022 (extended until 06/2023)

Founding: BMBF

Project partners: Infineon Technologie AG Neubiberg, Micro-Hybrid Electronic GmbH Hermsdorf, CMOS-IR Erfurt, Fraunhofer IKTS Hermsdorf, Fraunhofer IPM Freiburg im Breisgau