Ilmenau : Universitätsverlag Ilmenau, 2015. - XVII, 133 Seiten.
(Werkstofftechnik Aktuell ; 13)
ISBN 978-3-86360-120-1
URN urn:nbn:de:gbv:ilm1-2015000249
Preis (Druckausgabe): 16,40 €
Zugl.: Dissertation, Technische Universität Ilmenau, 2015
A method for the Finite-Element (FE) simulation of the Cold-Joining-Process (CJP) of massive copper contacts is developed in this thesis. The standard procedure for the calculation of interference fit connectors is not applicable to the joining process of massive copper components, since the contact area builds up in a context of considerable plastic deformation and high frictional loads. The new FE model not only shortens and optimizes the design cycle for novel High-Power-Connectors (HPCs), but also allows a deeper understanding of the CJP and the connector. The FE model is rolled out to real HPCs. The comparison between calculated and real features of the connector nails down the validity of the simulation. By means of this real example the capability of the new simulation method to set the ground for the design of future CJCs is demonstrated.
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