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Contact

Prof. Dr.-Ing. Jens Müller
Head of the Group

Telefon: +49 3677 69-2606

Videos Electronics Technology Group

Thermocompression Flip-Chip Bonding Process

How to assemble 3D electrodes on LTCC circuit boards (YouTube @Heike Bartsch)

Flow sensor (YouTube @Heike Bartsch)

Production of ceramic circuit boards (Sendung mit der Maus, YouToube @grafvonab)