SPIRIT

The SPIRIT project (System - in - Package Interposer based on innovative glass-ceramic composite technology) is concerned with the novel material system glass-glass ceramic as interposer substrate. The advantageous properties of each material or technology class are combined in a targeted manner. LTCC technology offers the possibility of multilayer module construction using thick-film technology. This means that passive 3D components can be integrated and, for example, a high wiring density or good thermal conductivity with thermal vias can be realized. The glass substrate, on the other hand, is suitable for thin-film technology and enables, among other things, micro-structuring of the metal layers. The integration of the two substrates and the technologies into a glass LTCC interposer is a new technology concept that opens up a new spectrum of possibilities for packaging and interconnection technology. The potential application platform of the new interposer includes radio frequency technology, sensing, optical systems, and assembly and interconnection technology for specific biological applications. In this project, the joining of glass wafers or substrates with unsintered LTCC films will be primarily explored. Furthermore, thermal, thermomechanical, electrical, dielectric and high frequency properties of the composite substrate will be investigated and the application in packaging technology will be tested.

Subproject leader: Univ.-Prof. Dr.-Ing. Jens Müller

Contact: Dipl.-NanoSc. Mahsa Kaltwasser
Project duration: 04/2018 - 09/2021
Funding: Thüringer Aufbaubank Partners: VIA electronic GmbH, Siegert Thinfilm Technology GmbH