Students are able to evaluate basic requirements on advanced microelectronic packages and modules and can apply their knowledge in the design of new components. They are able to identify the relationship among semiconductor
devices, packages, modules and circuit boards and can evaluate these for
specific applications.

Lecture content:

Repetition of the basics of microelectronic packaging
Circuit board technologies
Assembly technologies

Packaging of components and modules
Packaging Roadmap
Interconnection types (FlipChip, BGA, CGA, LGA u.a.)
Multichipmodules
System-in-Packages (SiP)
System-on-Chip conceptStacked IC-technology, stacked Packages (PoP)
Chip embedding
3D-Chip-Packaging (TSV-processes)

Power-Packaging

Moulded Interconnect Device Technology

RF- and microwave packaging

MEMS-Packaging

Test and Inspection (Board, Module, AOI, X-Ray, US, ICT )

Methods of failure analysis