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Prof. Dr.-Ing. Jens Müller
Head of the Group
Telefon: +49 3677 69-2606
The subject covers basic knowledge regarding product cycle and properties of microelectronic assemblies. It contains the fundamentals of organic circuit boards (PCB), their structuring processes as well as assembly and mounting technologies to achieve a functional electronic system. In addition to these standard processes some alternative technologies will be introduced.
Design process and product cycle (from idea to the product)
Thermal management in microelectronics
Board technologies
Overview of available technologies
Materials and their properties
Additive and subtractive structuring processes
Practical work: design of a PCB
Microelectronic components
Mounting and assembly technologies (soldering, bonding, gluing, dispensing etc.)
Design and layout aspects of PCBs (electrical and thermal design)
Electromagnetic interference (EMI) and electromagnetic compatibility (EMC)
Basics of RF design
Hybrid circuit technologies
Thick- and Thinfilm technology
LTCC technology
Basics of component packaging