Electronics Technology 2

Lecture content:

Repetition of Thick film technology (Electronics Technology 1)

Consolidation of Thick-film technology
Substrate properties
Resistor parameters, adjustment, trim sensitivity
Design of DiS resistors
Conductor and dielectric materials

Thick-film circuit design
Structure of the layout system Hyde (differentiation to circuit board design)
Introduction to the Hyde program
Procedure for designing a DiS circuit
Dimensioning of thick-film circuits

Consolidation of multilayer ceramic technology
Tape production and material classes
tape-on-substrate technology
HTCC technology
LTCC technology and materials
Properties of multilayer ceramics

Heat dissipation solutions
Thick-film on alumina substrates
LTCC-M

Direct Copper Bonding technology for power electronic circuits
Production of the DCB substrates
Design of DCB circuits
Method of mounting components on DCB substrates
Reliability of DCB circuits

Reliability of microelectronic assemblies
failure statistics
Causes and mechanisms of failure
Reliability studies

Ceramic Packaging
1^st level packaging
2^nd level packaging

Seminar

Application of the lecture contents
Production and SMD assembly of a hybrid circuit
Optional: Excursion to an assembly house or the SMT connect fair