Functionalized Peripherics

Modern microelectronic components, packages and devices require different interfaces to connect the periphery electrically, thermally, mechanically, optically and fluidly in order to meet the requirements on power management, data transmission band width, signal frequency etc. These specific functions are covered in the lecture Functionalized Peripherics.

Students are able to identify and differentiate the requirements on the interface between nano structures (semiconductor) and the circuit board technology. They develop the ability to apply this knowledge for the conversion of electronic circuit requirements to the products and processes.

Lecture content:

In-depth module circuit board technology
Thick- and thinfilm processes
LTCC-technology
Flexible printed circuit boards
stretchable electronics
Silicon/ceramic composite substrates

RF- and microwave board technologies
Materials, properties
Lumped integrated passive components
Distributed integrated passive components
Design
Measurement principles

Ceramic sensors and actuators
Application scenarios
Sensor principles
Construction of ceramic sensors and actors
Sensor packaging

Ceramic technologies for microelectronic and microfluidic systems
Requirements and properties
Design
Technologies and processes
Applications

Microelectronic design- and manufacturing processes
Development process
Design of experiments approach
Reliability
Quality control in production

Micro-Nano- and Photonic Integration
Nanotechnology for Packaging
Optical Packages and Boards

Selected applications
Biomedical implants
Fotovoltaics
Solid State Ligthing