Publication list FG Nanotechnology

Anzahl der Treffer: 722
Erstellt: Fri, 26 Apr 2024 23:01:57 +0200 in 0.0440 sec


Reiprich, Johannes; Kups, Thomas; Schlag, Leslie; Isaac, Nishchay Angel; Biswas, Shantonu; Breiling, Jonas; Schaaf, Peter; Stauden, Thomas; Pezoldt, Jörg; Jacobs, Heiko O.
Corona assisted gallium oxide nanowire growth on silicon carbide. - In: Journal of crystal growth, Bd. 509 (2019), S. 107-111

https://doi.org/10.1016/j.jcrysgro.2018.12.033
Biswas, Shantonu; Kaltwasser, Mahsa; Reiprich, Johannes; Schlag, Leslie; Isaac, Nishchay Angel; Stauden, Thomas; Pezoldt, Jörg; Jacobs, Heiko O.
Metamorphic and stretchable electronic systems - a materials, assembly, and interconnection challenge. - In: Microsystems technology in Germany, ISSN 2191-7183, (2018), S. 64-65

Schlag, Leslie; Isaac, Nishchay Angel; Nahrstedt, Helene; Reiprich, Johannes; Pezoldt, Jörg; Jacobs, Heiko O.
Self aligning growth of nanoparticle-based interconnects. - In: 2018 IEEE 13th Nanotechnology Materials and Devices Conference (NMDC), (2018), insges. 4 S.

https://doi.org/10.1109/NMDC.2018.8605857
Lebedev, Alexander A.; Davydov, Valery Yu.; Usachov, Dmitry Yu.; Lebedev, Sergey P.; Smirnov, Alexander N.; Eliseyev, Ilya A.; Dunaevskiy, M. S.; Gushchina, E. V.; Bokai, K. A.; Pezoldt, Jörg
High quality graphene grown by sublimation on 4H-SiC (0001). - In: Semiconductors, ISSN 1090-6479, Bd. 52 (2018), 14, S. 1882-1885

https://doi.org/10.1134/S1063782618140154
Kaltwasser, Mahsa; Schmidt, Udo; Biswas, Shantonu; Reiprich, Johannes; Schlag, Leslie; Isaac, Nishchay Angel; Stauden, Thomas; Jacobs, Heiko O.
Core-shell transformation-imprinted solder bumps enabling low-temperature fluidic self-assembly and self-alignment of chips and high melting point interconnects. - In: ACS applied materials & interfaces, ISSN 1944-8252, Bd. 10 (2018), 47, S. 40608-40613

https://doi.org/10.1021/acsami.8b12390
Biswas, Shantonu; Reiprich, Johannes; Pezoldt, Jörg; Hein, Matthias; Stauden, Thomas; Jacobs, Heiko O.
Stress-adaptive meander track for stretchable electronics. - In: Flexible and printed electronics, ISSN 2058-8585, Bd. 3 (2018), 3, 032001, S. 1-7

Stretchable metallic interconnects are commonly designed using a meander-shaped metal track with a uniform width. This article reports on a 'stress-adaptive' metal track design which varies in width to accommodate the produced torque in the metal track during stretching. The stress-adaptive design is inspired by computational and experimental studies of two conventional meander-shape metal tracks identifying a common failure mode; specifically, the propagation of torque leading to twist and mechanical fatigue. The understanding gained led to the stress-adaptive design. The stress-adaptive structure is compared with horseshoe- and U-shaped references and shows improvements in the stress distribution, levels of twist, maximum level of elongation (>320%), and required stretch and release cycles (>6000 at 150% elongation) to cause failure in a long term cycling test.



https://doi.org/10.1088/2058-8585/aad583
Pezoldt, Jörg; Kalnin, Andrei Alexandrovich
Defects and polytype instabilities. - In: Silicon carbide and related materials 2017, (2018), S. 147-150

Auge, Manuel; Hähnlein, Bernd; Pezoldt, Jörg
Infrared reflectance study of the graphene/semi-insulating 6H-SiC(0001) heterostructure. - In: Silicon carbide and related materials 2017, (2018), S. 314-317

Eckstein, Marco; Koppka, Christian; Thiele, Sebastian; Mi, Yan; Xu, Rui; Lei, Yong; Hähnlein, Bernd; Schwierz, Frank; Pezoldt, Jörg
MOCVD compatible atomic layer deposition process of Al2O3 on SiC and graphene/SiC heterostructures. - In: Silicon carbide and related materials 2017, (2018), S. 506-510
Im Titel sind "2" und "3" tiefgestellt

Hesamedini, Sanez; Ecke, Gernot; Bund, Andreas
Structure and formation of trivalent chromium conversion coatings containing cobalt on zinc plated steel. - In: Journal of the Electrochemical Society, ISSN 1945-7111, Bd. 165 (2018), 10, Seite C657-C669

https://doi.org/10.1149/2.0951810jes