TU Ilmenau

Packaging and interconnection technology

In the field of packaging, ZMN's packaging assembly and interconnection technology includes not only wafer saws, wafer cleavers, flip-chip bonders and wire bonders, but also micro-technical interconnection technology for pre- and anodic bonding, LTCC and thick-film hybrid processing with screen printers, laminating presses and furnaces as well as the associated measurement technology and laser and precision processing with a multifunction laser and a picosecond laser.