Unsicherheit der simulierten Fixpunktemperatur von In, Sn und Zn in einer kleinen Mehrfachfixpunktzelle für Kalibrierung von Berührungsthermometern. - In: Sensoren und Messsysteme, (2018), S. 398-401
Bilateraler Vergleich der Messunsicherheit bei der Ermittlung dynamischer Kennwerte von Berührungsthermometern in Fluiden. - In: Sensoren und Messsysteme, (2018), S. 276-279
Prüfeinrichtung zur Untersuchung des dynamischen Verhaltens von Berührungsthermometern in Wasser. - In: Sensoren und Messsysteme, (2018), S. 273-275
Kalibrierung von Thermometern in situ im Prozess. - In: Sensoren und Messsysteme, (2018), S. 219-222
Reliable derivation of automotive antenna gain patterns from LTE communication parameters. - In: 2018 IEEE 87th Vehicular Technology Conference (VTC Spring), (2018), insges. 5 S.
https://doi.org/10.1109/VTCSpring.2018.8417494
Selective laser melting in heat exchanger development - experimental investigation of heat transfer and pressure drop characteristics of wavy fins. - In: Heat and mass transfer, ISSN 1432-1181, Bd. 54 (2018), 8, S. 2187-2193
To improve performance of heat exchangers for vehicle applications, it is necessary to increase the air side heat transfer. Selective laser melting gives rise to be applied for fin development due to: i) independency of conventional tooling ii) a fast way to conduct essential experimental studies iii) high dimensional accuracy iv) degrees of freedom in design. Therefore, heat exchanger elements with wavy fins were examined in an experimental study. Experiments were conducted for air side Reynolds number range of 1400-7400, varying wavy amplitude and wave length of the fins at a constant water flow rate of 9.0 m^3/h. Heat transfer and pressure drop characteristics were evaluated with Nusselt Number Nu and Darcy friction factor [psi] as functions of Reynolds number. Heat transfer and pressure drop correlations were derived from measurement data obtained by regression analysis.
https://doi.org/10.1007/s00231-018-2352-0
2D electronics - a promising option or a type C hype cycle?. - In: 2018 IEEE Electron Devices Technology and Manufacturing Conference (EDTM), ISBN 978-1-5386-3712-8, (2018), S. 233-235
https://doi.org/10.1109/EDTM.2018.8421466
Wafer-level re-packaging of commercial components for miniaturization and embedding. - In: 2018 IMAPS Nordic Conference on Microelectronics Packaging, ISBN 978-952-68150-5-3, (2018), S. 81-85
https://doi.org/10.23919/NORDPAC.2018.8423859
LTCC resistors - the influence of production conditions on the absolute value and its reproducibility. - In: 2018 IMAPS Nordic Conference on Microelectronics Packaging, ISBN 978-952-68150-5-3, (2018), S. 61-66
https://doi.org/10.23919/NORDPAC.2018.8423847
Experimental qualification of the strength enhancement of coated concrete parts. - In: Proceedings of the 18th International Conference of the European Society for Precision Engineering and Nanotechnology, (2018), S. 147-148