Holz, Mathias;
Reuter, Christoph; Reum, Alexander; Ahmad, Ahmad; Hofmann, Martin; Ivanov, Tzvetan; Mechold, Stephan; Rangelow, Ivo W.
Atomic force microscope integrated into a scanning electron microscope for fabrication and metrology at the nanometer scale. - In: Photomask Technology 2019, (2019), S. 111481F-1-111481F-8
https://doi.org/10.1117/12.2537018
Atomic force microscope integrated into a scanning electron microscope for fabrication and metrology at the nanometer scale. - In: Photomask Technology 2019, (2019), S. 111481F-1-111481F-8
https://doi.org/10.1117/12.2537018
Moosmann, Julian;
Wieland, Florian; Zeller-Plumhoff, Berit; Galli, Silvia; Krüger, Diana; Ershov, Alexey; Lautner, Silke; Sartori, Julian; Dean, Mason; Köhring, Sebastian; Burmester, Hilmar; Dose, Thomas; Peruzzi, Niccolò; Wennerberg, Ann; Willumeit-Römer, Regine; Wilde, Fabian; Heuser, Philipp; Hammel, Jörg Ulrich; Beckmann, Felix
A load frame for in situ tomography at PETRA III. - In: Developments in X-Ray Tomography XII, (2019), S. 1111318-1-1111318-17
https://doi.org/10.1117/12.2530445
A load frame for in situ tomography at PETRA III. - In: Developments in X-Ray Tomography XII, (2019), S. 1111318-1-1111318-17
https://doi.org/10.1117/12.2530445
Petrich, Rebecca; Bartsch, Heike; Tonisch, Katja; Jaekel, Konrad; Barth, Stephan; Bartzsch, Hagen R.; Glöß, Daniel; Delan, Annekatrin; Krischok, Stefan; Strehle, Steffen; Hoffmann, Martin; Müller, Jens
Investigation of ScAlN for piezoelectric and ferroelectric applications. - In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), (2019), insges. 5 S.
https://doi.org/10.23919/EMPC44848.2019.8951824
Investigation of ScAlN for piezoelectric and ferroelectric applications. - In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), (2019), insges. 5 S.
https://doi.org/10.23919/EMPC44848.2019.8951824
Fischer, Michael; Werthes, Tobias; Kleinholz, Cathleen; Müller, Jens
Active cooling using fluid channels in a silicon-ceramic composite substrate. - In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), (2019), insges. 5 S.
https://doi.org/10.23919/EMPC44848.2019.8951844
Active cooling using fluid channels in a silicon-ceramic composite substrate. - In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), (2019), insges. 5 S.
https://doi.org/10.23919/EMPC44848.2019.8951844
Bartsch, Heike;
Pezoldt, Jörg; Morales Sanchez, Francico M.; Jimenez Rios, Juan J.; Mánuel Delgado, Jose M.; Breiling, Jonas; Müller, Jens
LTCC as substrate - enabling semiconductor and packaging integration. - In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), (2019), insges. 4 S.
https://doi.org/10.23919/EMPC44848.2019.8951794
LTCC as substrate - enabling semiconductor and packaging integration. - In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), (2019), insges. 4 S.
https://doi.org/10.23919/EMPC44848.2019.8951794
Schulz, Alexander;
Gutzeit, Nam; Müller, Jens
Laser structured passive components and RF filter in LTCC technology with operating frequencies up to 40 GHz focusing on 5G mobile applications. - In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), (2019), insges. 5 S.
https://doi.org/10.23919/EMPC44848.2019.8951846
Laser structured passive components and RF filter in LTCC technology with operating frequencies up to 40 GHz focusing on 5G mobile applications. - In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), (2019), insges. 5 S.
https://doi.org/10.23919/EMPC44848.2019.8951846
Gutzeit, Nam; Schulz, Alexander; Fischer, Michael; Thelemann, Torsten; Müller, Jens
Picosecond laser structuring technology for LTCC - the improvement of fine line structuring. - In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), (2019), insges. 5 S.
https://doi.org/10.23919/EMPC44848.2019.8951813
Picosecond laser structuring technology for LTCC - the improvement of fine line structuring. - In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), (2019), insges. 5 S.
https://doi.org/10.23919/EMPC44848.2019.8951813
Köhler, Tobias; Regensburg, Anna; Petzoldt, Franziska; Bergmann, Jean Pierre
Eutectic phase formation during friction stir spot welding of aluminum and copper dissimilar joints. - In: 7th International Brazing and Soldering Conference 2018, (2019), S. 62-68
Eutectic phase formation during friction stir spot welding of aluminum and copper dissimilar joints. - In: 7th International Brazing and Soldering Conference 2018, (2019), S. 62-68
Han, Niu;
Dupleich, Diego; Müller, Robert; Skoblikov, Sergii; Schneider, Christian; Del Galdo, Giovanni; Thomä, Reiner
Hybrid ray tracing method for millimeter wave propagation simulation in large indoor scenarios. - In: WSA 2019, (2019), S. 99-104
https://ieeexplore.ieee.org/document/8727201
Hybrid ray tracing method for millimeter wave propagation simulation in large indoor scenarios. - In: WSA 2019, (2019), S. 99-104
https://ieeexplore.ieee.org/document/8727201
Meister, Andreas;
Mohr-Weidenfeller, Laura; Kirchner, Johannes; Hofmann, Martin; Mastylo, Rostyslav; Füßl, Roland; Reger, Johann; Manske, Eberhard
Trans-scale nanofabrication with nanopositioning and nanomeasuring machines. - In: IFAC-PapersOnLine, ISSN 2405-8963, Bd. 52 (2019), 15, S. 151-156
https://doi.org/10.1016/j.ifacol.2019.11.666
Trans-scale nanofabrication with nanopositioning and nanomeasuring machines. - In: IFAC-PapersOnLine, ISSN 2405-8963, Bd. 52 (2019), 15, S. 151-156
https://doi.org/10.1016/j.ifacol.2019.11.666